Lemass Optoelectronic Co., Ltd.
NEW LEMASS NEW VISION
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P1.2 indoor high-resolution micro LED16:9 LMS-Q COB packaging XR wide color gamut
Description:
Flip-chip COB is the next generation technology advance in COB. Flip-chip COB will save the step of wire bonding, which results in a more higher effective luminous area under the same chip size, 20% energy saving & reduce temperature rise. As there is no bonding wire over light path block the light. Flip-clip COB will have 40% larger luminous chip size, which can contribute to higher peak brightness up to 2000cd/m. Higher black occupancy contributes to 4 times higher contrast.
Quick Detail:
· Support HDR display
· Refresh rate 7680Hz
· Flip-chip common cathode
· 10000:1 ultra high contrast ratio
· COB process design
· XR wide color gamut
Specifications:
| Parameter Item | LMS-Q1.2 |
| Pixel Pitch (mm) | 1.25 |
| Pixel Density (pixels/sqm) | 640,000 |
| Module Resolution | 120x135 |
| Cabinet Resolution | 480x270 |
| Mask | No |
| Lamp Type | COB1.25 |
| Cabinet Size (mm) | 600x337.5x39 |
| Cabinet Weight (kg) | 6.4 |
| Brightness (cd/sqm) | 600 |
| Gray Scale (Bit) | 16 |
| Color Temp (k) | 3000~9000 |
| Control System | Synchronous Control |
| Protection Level | Front IP31, Rear IP43 |
| Intelligent Storage | AI Intelligent Storage |
| Frame Frequency (Hz) | 50/60FPS |
| Refresh Rate(Hz) | 3840/7680(Optional) |
| Working Voltage | 100-240V AC, 50/60Hz |
| Power Consumption (W/ m²) | Max:≤262,Ave:≤105 |
| Lifetime (hrs) | 100,000 |
| Operating Temp (℃) | -10～+40 |
| Storage Temp (℃) | -25~+60 |
| Humidity Range(Rh) | 10%~80%, Non-condensing |
| Pixel Correction | Brightness And Color Correction |
Details about the product:
Applications:
Widely used in conference centers, controlling centers, data centers and large-scale occasions, etc.